A new soldering process to replace manual positioning and oven-welding. Copper Top-pin or Pack-pin covered with a silver-tin alloy must be soldered on a DBC substrates (Direct Bond Copper), composed of a ceramic insulator, on which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic. DBC high thermal conductivity prevents any contact based soldering techniques. A laser welding system can quickly and easily solder the pins as the high peck power overcomes the thermal conductivity effects.
The Kubo is a compact and flexible fiber-coupled laser for manual and automatic spot...
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